2595 Bond St University Park, IL 60484-3103
- Commercial land
- 1.88 lot acres
Jan 17, 2023
Current Use by Public Records
- Metaltek Fabricating Inc / Welder
- Chicago Bullet Proof Systems Inc / Manufacturer
Property Details for 2595 Bond St
- Lot size
- 1.88 lot acres
- Property type
- Commercial land
- APN
- 21-14-17-202-007
- APU
- 211417202007
Value Estimation
-
CAP approach
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Comparable approach
-
Alternative Use
Location Insight
- Map
- Local Demand
- City
- University Park
- County
- Will
- State
- Illinois
- Longitude
- -87.7523
- Latitude
- 41.4351
- CBSA code
- 16980
- CBSA name
- CHICAGO-NAPERVILLE-JOLIET, IL-IN-WI METROPOLITAN STATISTICAL AREA